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Search Results (664 CVEs found)

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CVE Vendors Products Updated CVSS v3.1
CVE-2017-18277 1 Qualcomm 46 Mdm9206, Mdm9206 Firmware, Mdm9607 and 43 more 2024-11-21 N/A
When dynamic memory allocation fails, currently the process sleeps for one second and continues with infinite loop without retrying for memory allocation in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, QCN5502, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 600, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835.
CVE-2017-18276 1 Qualcomm 18 Mdm9206, Mdm9206 Firmware, Mdm9607 and 15 more 2024-11-21 N/A
Secure camera logic allows display/secure camera controllers to access HLOS memory during secure display or camera session in Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835, SD 845, SD 850
CVE-2017-18275 1 Qualcomm 42 Mdm9206, Mdm9206 Firmware, Mdm9607 and 39 more 2024-11-21 N/A
A new account can be inserted into simContacts service using Android command line tool in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845.
CVE-2017-18274 1 Qualcomm 32 Mdm9206, Mdm9206 Firmware, Mdm9607 and 29 more 2024-11-21 N/A
While iterating through the models contained in a fixed-size array in the actData structure, which also stores an incorrect number of models that is greater than the size of the array, a buffer overflow occurs in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835
CVE-2017-18160 1 Qualcomm 16 Mdm9635m, Mdm9635m Firmware, Mdm9645 and 13 more 2024-11-21 N/A
AGPS session failure in GNSS module due to cyphersuites are hardcoded and needed manual update everytime in snapdragon mobile and snapdragon wear in versions MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 835, SD 845, SD 850
CVE-2017-18157 1 Qualcomm 42 Mdm9206, Mdm9206 Firmware, Mdm9607 and 39 more 2024-11-21 N/A
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
CVE-2017-18156 1 Qualcomm 24 Mdm9206, Mdm9206 Firmware, Mdm9607 and 21 more 2024-11-21 N/A
While processing camera buffers in camera driver, a use after free condition can occur in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 625, SD 820, SD 820A, SD 835, SDX20.
CVE-2017-18146 1 Qualcomm 56 Mdm9206, Mdm9206 Firmware, Mdm9607 and 53 more 2024-11-21 N/A
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, in some corner cases, ECDSA signature verification can fail.
CVE-2017-18142 1 Qualcomm 10 Mdm9650, Mdm9650 Firmware, Mdm9655 and 7 more 2024-11-21 N/A
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile MDM9650, MDM9655, SD 835, SD 845, SD 850, while processing the IMS SIP username, a buffer overflow can occur.
CVE-2017-18141 1 Qualcomm 68 Ipq8074, Ipq8074 Firmware, Mdm9206 and 65 more 2024-11-21 N/A
When a 3rd party TEE has been loaded it is possible for the non-secure world to create a secure monitor call which will give it access to privileged functions meant to only be accessible from the TEE in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016.
CVE-2017-18140 1 Qualcomm 48 Mdm9206, Mdm9206 Firmware, Mdm9607 and 45 more 2024-11-21 N/A
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, when processing a call disconnection, there is an attempt to print the RIL token-id to the debug log. If eMBMS service is enabled while processing the call disconnect, a Use After Free condition may potentially occur.
CVE-2017-18139 1 Qualcomm 60 Mdm9206, Mdm9206 Firmware, Mdm9607 and 57 more 2024-11-21 N/A
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, a buffer overflow vulnerability may potentially exist while making an IMS call.
CVE-2017-18138 1 Qualcomm 56 Mdm9206, Mdm9206 Firmware, Mdm9607 and 53 more 2024-11-21 N/A
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, in GERAN, a buffer overflow may potentially occur.
CVE-2017-18137 1 Qualcomm 22 Mdm9640, Mdm9640 Firmware, Mdm9645 and 19 more 2024-11-21 N/A
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile MDM9640, MDM9645, MDM9650, MDM9655, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 835, while processing the IPv6 pdp address of the pdp context, a buffer overflow can occur.
CVE-2017-18136 1 Qualcomm 52 Mdm9206, Mdm9206 Firmware, Mdm9607 and 49 more 2024-11-21 N/A
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 820, SD 820A, SD 835, SD 845, in the omx aac component, a Use After Free condition may potentially occur.
CVE-2017-18135 1 Qualcomm 18 Mdm9650, Mdm9650 Firmware, Mdm9655 and 15 more 2024-11-21 N/A
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile MDM9650, MDM9655, SD 450, SD 625, SD 650/52, SD 835, SD 845, SD 850, in the Wireless Data Service (WDS) module, a buffer overflow can occur.
CVE-2017-18133 1 Qualcomm 14 Mdm9206, Mdm9206 Firmware, Mdm9607 and 11 more 2024-11-21 N/A
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835, an out of bound access for ebi channel array can potentially occur.
CVE-2017-18130 1 Qualcomm 44 Mdm9206, Mdm9206 Firmware, Mdm9607 and 41 more 2024-11-21 N/A
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 820, SD 820A, SD 835, SD 845, while playing an ASF file, a buffer over-read can potentially occur.
CVE-2017-18126 1 Qualcomm 70 Mdm9206, Mdm9206 Firmware, Mdm9607 and 67 more 2024-11-21 N/A
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9640, MDM9650, QCA6174A, QCA6574, QCA6574AU, QCA6584, QCA6584AU, QCA9377, QCA9379, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016, the original mac spoofing feature does not use the following in probe request frames: (a) randomized sequence numbers and (b) randomized source address for cfg80211 scan, vendor scan and pno scan which may affect user privacy.
CVE-2017-18125 1 Qualcomm 18 Mdm9206, Mdm9206 Firmware, Mdm9607 and 15 more 2024-11-21 N/A
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835, SD 845, SD 850, when secure camera is activated it stores captured data in protected buffers. The TEE application which uses secure camera expects those buffers to contain data captured during the current camera session. It is possible though for HLOS to put aside and reuse one or more of the protected buffers with previously captured data during next camera session. Such data reuse must be prevented as the TEE applications expects to receive valid data captured during the current session only.